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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	17806311	Filing Dt:	06/10/2022
Publication #:	20230402417	Pub Dt:	12/14/2023
Inventors:	Chih-Ju YEN, Chien-Sheng CHEN, Chien LI, Jui Hsien LO, Shin-Puu JENG
Title:	SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

Assignment: 1

Reel/Frame:

060185/0287

Recorded: 06/13/2022

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

LI, LEO

Exec Dt:

06/12/2022

YEN, CHIH-JU

Exec Dt:

06/12/2022

LO, JUI HSIEN

Exec Dt:

06/12/2022

CHEN, CHIEN-SHENG

Exec Dt:

06/12/2022

JENG, SHIN-PUU

Exec Dt:

06/12/2022

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

HARRITY & HARRITY, LLP

11350 RANDOM HILLS ROAD

SUITE 600

FAIRFAX, VA 22030

Assignment: 2

Reel/Frame:

060777/0164

Recorded: 07/20/2022

Pages: 7

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE THE FIRST NAME OF THE FIRST INVENTOR PREVIOUSLY RECORDED AT REEL: 060185 FRAME: 0287. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

LI, CHIEN

Exec Dt:

06/30/2022