Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18032151
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Filing Dt:
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04/14/2023
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Publication #:
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Pub Dt:
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12/14/2023
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Inventors:
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Noritoshi Araki, Takumi OOKABE, Daizo ODA, Tomohiro UNO, Tetsuya OYAMADA
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Title:
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Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, NW |
| WASHINGTON, DC 20001 |
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04/29/2024 03:13 PM
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