Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18151758
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Filing Dt:
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01/09/2023
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Publication #:
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Pub Dt:
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12/14/2023
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Inventors:
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Chien-Fu Tseng, Yu Chieh Yung, Cheng-Hsien Hsieh, Wei-Cheng Wu, Der-Chyang Yeh et al
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Title:
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Methods of Forming Packages and Resulting Structures
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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05/17/2024 09:42 AM
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