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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17838994
Filing Dt:
06/13/2022
Publication #:
Pub Dt:
12/14/2023
Inventors:
Bi-Shen LEE, Chia-Wei HU, Hai-Dang TRINH, Min-Ying TSAI, Ching I LI, Hsun-Chung KUANG et al
Title:
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
Assignment: 1
Reel/Frame:
060986/0075Recorded: 09/03/2022Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/04/2022
Exec Dt:
08/26/2022
Exec Dt:
07/04/2022
Exec Dt:
07/05/2022
Exec Dt:
07/04/2022
Exec Dt:
08/25/2022
Exec Dt:
07/04/2022
Assignee:
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
NZ CARR LAW OFFICE
2101 CITYWEST BLVD STE 100
HOUSTON, TX 77042

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