Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17829252
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Filing Dt:
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05/31/2022
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Michael Su, Siddharth Ravichandran, Bryan Black, Michael Alfano
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Title:
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Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1114 CLIFF VIEW DRIVE |
| SPICEWOOD, TEXAS 78669 |
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| TERRILE, CANNATTI & CHAMBERS, LLP |
| P.O. BOX 203518 |
| AUSTIN, TX 78720 |
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