Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18099931
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Filing Dt:
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01/21/2023
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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KAI LIU, YAQIN WANG
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCTOR PACKAGING MEMBER AND MOUNTING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 5 PUTUOSHAN ROAD, SUZHOU SUQIAN INDUSTRIAL PARK |
| SUQIAN CITY, JIANGSU PROVINCE, CHINA 223814 |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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