Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18036729
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Filing Dt:
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05/12/2023
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Yoshiaki Sakaniwa, Toyo Ohashi, Marina Sakamaki, Kenji Kubota
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Title:
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HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| LOCKE LORD LLP |
| 701 8TH ST NW, SUITE 500 |
| WASHINGTON, DC 20001-4360 |
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05/10/2024 11:47 AM
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