Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18216617
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Filing Dt:
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06/30/2023
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Ning Zeng, Kai Murakami, Kimiyasu Makino, Hidehiro Matsushita
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Title:
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Connector Assembly
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-5-4 FUKAMI-HIGASHI |
| YAMATO, KANAGAWA, JAPAN 242-8585 |
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| MOLEX JAPAN, LLC |
| 1-5-4 FUKAMI-HIGASHI |
| YAMATO, KANAGAWA, 242-8585 JAPAN |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2222 WELLINGTON COURT |
| LISLE, ILLINOIS 60532 |
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| MOLEX, LLC |
| 2222 WELLINGTON COURT |
| LISLE, IL 60532 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 110 INTERNATIONAL ROAD |
| JURONG TOWN, SINGAPORE 05 629174 |
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| MOLEX SINGAPORE PTE. LTD. |
| 110 INTERNATIONAL ROAD |
| JURONG TOWN, 05 629174 SINGAPORE |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2222 WELLINGTON COURT |
| LISLE, ILLINOIS 60532 |
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| MOLEX, LLC |
| 2222 WELLINGTON COURT |
| LISLE, IL 60532 |
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05/08/2024 12:12 PM
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