Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18209737
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Filing Dt:
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06/14/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventors:
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Yoshihiro TSUTSUMI, Yuki KUDO, Tadaharu IKEDA, Hiroyuki IGUCHI, Atsushi TSUURA
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Title:
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CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, ADHESIVE, ADHESIVE FILM, PREPREG, INTERLAYER INSULATING MATERIAL, AND PRINTED-WIRING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1000005 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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