Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18039155
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Filing Dt:
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05/26/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventors:
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Jung Hun KWAK, Byung Hyang KWON, Yong Jun CHO, Gi Chung KWON, Woo Jae KIM
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Title:
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METHOD FOR ETCHING SILICON-CONTAINING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 63, GAHEUNGGONDAN-RO |
| YEONGJU-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 36059 |
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| 20, GWANGUN-RO, NOWON-GU |
| SEOUL, KOREA, REPUBLIC OF 01897 |
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| PARATUS LAW GROUP, PLLC |
| 1765 GREENSBORO STATION PLACE |
| SUITE 320 |
| TYSONS CORNER, VA 22102 |
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