Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18212395
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Filing Dt:
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06/21/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventors:
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Takahiro HAMADA, Osamu Yamazaki
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Title:
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SUBSTRATE PROCESSING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, KASAMA 2-CHOME, SAKAE-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 247-8610 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| SUITE 9000 |
| WASHINGTON, DC 20006 |
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