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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17847787
Filing Dt:
06/23/2022
Publication #:
Pub Dt:
12/28/2023
Inventors:
Ying-Chi SU, Hung-Hsu CHEN, Ming-Hsing TSAI, Li-Wei CHU, Chih-Wei CHANG
Title:
METHOD FOR FORMING DUAL SILICIDE IN MANUFACTURING PROCESS OF SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
060939/0365Recorded: 08/30/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/12/2022
Exec Dt:
07/19/2022
Exec Dt:
08/05/2022
Exec Dt:
07/19/2022
Exec Dt:
07/20/2022
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100 E
FALLS CHURCH, VA 22042

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