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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17851097
Filing Dt:
06/28/2022
Publication #:
Pub Dt:
12/28/2023
Inventors:
Hsien-Wen Liu, Shih-Ting Hung, Jyun-Lin Wu, Yao-Chun Chuang, Yinlung Lu
Title:
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
Assignment: 1
Reel/Frame:
060329/0873Recorded: 06/28/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/14/2022
Exec Dt:
06/14/2022
Exec Dt:
06/24/2022
Exec Dt:
06/14/2022
Exec Dt:
06/14/2022
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
FAY SHARPE LLP
1228 EUCLID AVENUE, 5TH FLOOR
THE HALLE BUILDING
CLEVELAND, OH 44115

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