Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/23/2024
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Application #:
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18307765
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Filing Dt:
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04/26/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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De WU, Shuhang LIAO, Ting LI, Junxing SU
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Title:
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COMPOSITION, ADHESIVE FILM AND CHIP PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 1710, 17F, OVERSEAS TALENT BUILDING A |
| NO 999 GAOXIN AVE.,WUHAN E. LAKE HI-TECH DEVELOPMENT ZONE |
| WUHAN, CHINA |
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| NITIN KAUSHIK |
| 50 LERER LANE |
| STATEN ISLAND, NY 10307 |
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05/28/2024 05:35 AM
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