Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18370033
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Filing Dt:
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09/19/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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Takashi SAMESHIMA, Koji MAEKAWA, Katsumasa YAMAGUCHI
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Title:
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Tungsten Film-Forming Method, Film-Forming System and Storage Medium
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, CHINA 1076325 |
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| NATH, GOLDBERG & MEYER |
| 112 S WEST STREET |
| 36388UAY_JLM_HJ |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 064966 FRAME: 0950. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 1076325 |
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| NATH, GOLDBERG & MEYER |
| 112 S WEST STREET |
| 36388UAY_JLM_HJ |
| ALEXANDRIA, VA 22314 |
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04/29/2024 02:35 PM
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