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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
18216018
Filing Dt:
06/29/2023
Publication #:
Pub Dt:
01/04/2024
Inventors:
Tong Tong, Bing Wu Zhang, Mr. Zheng He He
Title:
MRI System and RF Coil Assembly Thereof
Assignment: 1
Reel/Frame:
064748/0995Recorded: 08/30/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/17/2023
Exec Dt:
08/22/2023
Exec Dt:
08/22/2023
Assignee:
SHENZHEN HI-TECH INDUSTRIAL PARK, SIEMENS CMRI CENTER, GAOXIN C.AVE
SHENZHEN, CHINA 518057
Correspondent:
BANNER & WITCOFF LTD.
71 SOUTH WACKER DRIVE
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
064749/0060Recorded: 08/30/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/22/2023
Assignee:
HENKESTRASSE 127
ERLANGEN, GERMANY 91052
Correspondent:
BANNER & WITCOFF LTD.
71 SOUTH WACKER DRIVE
CHICAGO, IL 60606
Assignment: 3
Reel/Frame:
066267/0346Recorded: 12/20/2023Pages: 463
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2023
Assignee:
HENKESTR. 127
ERLANGEN, GERMANY 91052
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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