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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	18029481	Filing Dt:	03/30/2023
Publication #:	20240004294	Pub Dt:	01/04/2024
Inventors:	Yasuhiro OKAWA, Shintaro NASU, Masakazu KANEKO, Hirokazu ODA
Title:	CURABLE RESIN COMPOSITION FOR SILICON-CONTAINING RESIST, PATTERN FORMING METHOD, METHOD FOR PRODUCING IMPRINT MOLD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Assignment: 1

Reel/Frame:

063267/0899

Recorded: 03/30/2023

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

OKAWA, YASUHIRO

Exec Dt:

03/13/2023

NASU, SHINTARO

Exec Dt:

03/13/2023

KANEKO, MASAKAZU

Exec Dt:

03/15/2023

ODA, HIROKAZU

Exec Dt:

03/16/2023

Assignee:

DAI NIPPON PRINTING CO., LTD.

1-1 ICHIGAYA-KAGACHO 1-CHOME, SHINJUKU-KU

TOKYO-TO, JAPAN 162-8001

Correspondent:

JOHN A. RADI

OLIFF PLC

P.O. BOX 320850

ALEXANDRIA, VA 22320-4850

Assignment: 2

Reel/Frame:

064067/0988

Recorded: 05/02/2023

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED ON REEL 063267 FRAME 0899. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

OKAWA, YASUHIRO

Exec Dt:

03/13/2023