Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17853428
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Filing Dt:
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06/29/2022
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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JUNG-HUA CHANG, JING-CHENG LIN
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Title:
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BONDING MACHINE FOR WARPED SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F., NO.1, JIAZHENG 1ST ST., ZHUBEI CITY, |
| HSINCHU COUNTY, TAIWAN 302 |
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| HDLS IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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06/07/2024 10:37 AM
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