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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17856801
Filing Dt:
07/01/2022
Publication #:
20240006332
Pub Dt:
01/04/2024
Inventors:
Dimitrios Antartis, Nitin A. Deshpande, Siyan Dong, Omkar Karhade, Gwang-soo Kim et al
Title:
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATED CIRCUIT DIES
Assignment: 1
Reel/Frame:
061866/0585Recorded: 11/23/2022Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ANTARTIS, DIMITRIOS
Exec Dt:
06/08/2022
DESHPANDE, NITIN A
Exec Dt:
08/03/2022
DONG, SIYAN
Exec Dt:
06/17/2022
KARHADE, OMKAR
Exec Dt:
06/02/2022
KIM, GWANG-SOO
Exec Dt:
11/23/2022
LIFF, SHAWNA
Exec Dt:
06/10/2022
MAL, SIDDHARTHA
Exec Dt:
06/03/2022
MALLIK, DEBENDRA
Exec Dt:
06/17/2022
MINN, KHANT
Exec Dt:
06/17/2022
NIAZI, HARIS KHAN
Exec Dt:
06/09/2022
SARKAR, ARNAB
Exec Dt:
06/02/2022
SHI, YI
Exec Dt:
06/02/2022
ZHANG, BOTAO
Exec Dt:
06/30/2022
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ESSENTIAL PATENTS GROUP, LLP.
5 CENTERPOINTE DRIVE
SUITE 400
LAKE OSWEGO, OR 97035

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