Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18213943
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Filing Dt:
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06/26/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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SHUAI YANG, HONGDE DAI, JIAN XU
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Title:
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CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 78 CHANGSHAN ROAD, JIANGYIN |
| WUXI CITY, JIANGSU PROVINCE, CHINA 214430 |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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