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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17809574
Filing Dt:
06/29/2022
Publication #:
Pub Dt:
01/04/2024
Inventors:
Toyohiro Aoki, RISA MIYAZAWA, Keiji Matsumoto, Takahito Watanabe, Takashi Hisada
Title:
SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE
Assignment: 1
Reel/Frame:
060348/0628Recorded: 06/29/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/24/2022
Exec Dt:
06/24/2022
Exec Dt:
06/23/2022
Exec Dt:
06/23/2022
Exec Dt:
06/29/2022
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION - PATENT CENTER
1701 NORTH STREET BUILDING
B 256-3
ENDICOTT, NY 13760

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