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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17856830
Filing Dt:
07/01/2022
Publication #:
Pub Dt:
01/04/2024
Inventors:
Suddhasattwa Nad, Srinivas Pietambaram, Rahul Manepalli, Marcel Wall, Darko Grujicic
Title:
METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES
Assignment: 1
Reel/Frame:
060592/0032Recorded: 07/22/2022Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/01/2022
Exec Dt:
07/01/2022
Exec Dt:
07/21/2022
Exec Dt:
07/20/2022
Exec Dt:
06/30/2022
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ESSENTIAL PATENTS GROUP, LLP.
5 CENTERPOINTE DRIVE
SUITE 400
LAKE OSWEGO, OR 97035

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