Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17863408
|
Filing Dt:
|
07/13/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/18/2024
| | | | |
|
Inventors:
|
Sheng-Fan Yang, Chih-Chiang Hung, Yuan-Hung Lin, Shih-Hsuan Hsu, Igor Elkanovich
|
|
Title:
|
COMMUNICATION INTERFACE STRUCTURE AND DIE-TO-DIE PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.10, LIXING 6TH RD., SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN 30078 |
|
|
|
| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
|
|
Search Results as of:
05/18/2024 05:39 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
