Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18039090
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Filing Dt:
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05/26/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Akane TANAKA, Takeshi YAHAGI
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Title:
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Solder Material and Solder Material Production Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 32-1, SENJU ASAHI-CHO, ADACHI-KU |
| TOKYO, JAPAN 1200026 |
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| KILYK & BOWERSOX, P.L.L.C. |
| 3925 CHAIN BRIDGE RD., SUITE D-401 |
| FAIRFAX, VA 22030 |
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05/12/2024 02:33 PM
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