Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18027146
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Filing Dt:
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03/20/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Hideto Mitsuoka, Hiroshi Kiyama, Yukitane Kimoto, Hideaki Machida, Masakazu Okui
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Title:
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MOLDING BASE MATERIAL, MOLDED PRODUCT USING SAME, AND PRODUCTION METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 103-8666 |
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| 1-1, NIHONBASHI-HONCHO 1-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 103-0023 |
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| IP GROUP OF DLA PIPER LLP (US) |
| ONE LIBERTY PLACE |
| 1650 MARKET ST, SUITE 5000 |
| PHILADELPHIA, 19103 UNITED STATES |
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