Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18265971
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Filing Dt:
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06/08/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Masashi YAMAURA, Michitoshi ARATA, Ayumi NAKAYAMA, Yusuke KONDOH, Yuji NOGUCHI
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Title:
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MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, |
| TOKYO, JAPAN 105-8518 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 JAPAN |
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Assignment:
2
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| 9-1, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-7325 |
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| ALAN E. SCHIAVELLI |
| SUITE 2100 |
| 120 SOUTH LASALLE STREET |
| CHICAGO, IL 60603 |
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05/09/2024 09:01 AM
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