Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18354655
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Filing Dt:
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07/19/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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KyungEun KIM, YouJin SHIN, InWeon RA
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Title:
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HEAT SPREADER ASSEMBLY FOR USE WITH A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| JUN HE LAW OFFICES P. C. |
| 20380 TOWN CENTER LANE, SUITE 128 |
| CUPERTINO, CA 95014 |
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