Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18028512
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Filing Dt:
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03/24/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Changcheng WANG, Yusheng TANG, Xianye MAO, Jianwen GUO
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Title:
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HEAT DISSIPATION STRUCTURE OF COOLING PLATE FOR POWER SEMICONDUCTOR MODULE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 66 ZHUJIANG ROAD |
YANTAI ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA |
YANTAI, SHANDONG, CHINA 264006 |
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APEX ATTORNEYS AT LAW, LLP |
160 ALAMO PLAZA #942 |
ALAMO, CA 94507 |
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06/06/2024 11:38 AM
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