Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18220891
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Filing Dt:
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07/12/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Xianming CHEN, Yejie HONG, Gao HUANG, Benxia HUANG, Jindong FENG, Guilin ZHU, Yue BAO
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Title:
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MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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349 FUXI ROAD, CHONGCHUAN DISTRICT, NANTONG, |
JIANGSU PROVINCE, CHINA 226000 |
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THE PL LAW GROUP, PLLC |
13800 COPPERMINE ROAD |
FL 1-3 |
HERNDON, VA 20171 |
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05/13/2024 10:34 PM
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