Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17869297
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Filing Dt:
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07/20/2022
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Zheng-Yong LIANG, Wei-Ting YEH, Yu-Yun PENG, Keng-Chu LIN
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Title:
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WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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