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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18039957
Filing Dt:
06/01/2023
Publication #:
20240034833
Pub Dt:
02/01/2024
Inventors:
Yuta SUKEGAWA, Arisa YAMAUCHI, Mika TANAKA, Tomoki HIRAI, Yuji NOGUCHI, Yusuke KONDO et al
Title:
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
Assignment: 1
Reel/Frame:
063848/0680Recorded: 06/04/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SUKEGAWA, YUTA
Exec Dt:
05/16/2023
YAMAUCHI, ARISA
Exec Dt:
05/16/2023
TANAKA, MIKA
Exec Dt:
05/16/2023
HIRAI, TOMOKI
Exec Dt:
05/12/2023
NOGUCHI, YUJI
Exec Dt:
05/12/2023
KONDO, YUSUKE
Exec Dt:
05/12/2023
ARATA, MICHITOSHI
Exec Dt:
05/16/2023
YAMAURA, MASASHI
Exec Dt:
05/12/2023
NAKAYAMA, AYUMI
Exec Dt:
05/12/2023
Assignee:
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,
TOKYO, JAPAN 105-8518
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN
Assignment: 2
Reel/Frame:
066547/0677Recorded: 02/09/2024Pages: 26
Conveyance:
CHANGE OF ADDRESS
Assignor:
RESONAC CORPORATION
Exec Dt:
10/01/2023
Assignee:
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME
MINATO-KU
TOKYO, JAPAN 105-7325
Correspondent:
ALAN E. SCHIAVELLI
SUITE 2100
120 SOUTH LASALLE STREET
CHICAGO, IL 60603

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