Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18354705
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Filing Dt:
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07/19/2023
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Publication #:
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Pub Dt:
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02/01/2024
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Inventor:
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Hironobu HYAKUTAKE
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Title:
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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 1076325 |
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| ARMSTRONG TEASDALE LLP |
| 7700 FORSYTH BLVD. |
| SUITE 1800 |
| ST. LOUIS, MO 63105 |
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04/29/2024 04:42 AM
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