Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17815784
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Filing Dt:
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07/28/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Kai Liu, Jui-Yi Chiu, Nosun Park, Je-Hsiung Lan, Jonghae Kim, Periannan Chidambaram
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Title:
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INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| W&T/QUALCOMM |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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05/13/2024 11:41 AM
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