Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18268675
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Filing Dt:
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06/21/2023
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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Seiichi MATSUMOTO, Yuji SUGITANI, Ken IMAI, Yu ISHIDA, Makoto KUSHIHASHI
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Title:
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COPPER ALLOY POWDER FOR LAMINATING AND SHAPING AND METHOD OF EVALUATING THAT, METHOD OF MANUFACTURING COPPER ALLOY OBJECT, AND COPPER ALLOY OBJECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 176, NAKANONO-CHO, MATSUBARA-DORI MUROMACHI |
| NISHI-IRU, SHIMOGYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 600-8435 |
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| SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
| 650 TOWN CENTER DRIVE, 10TH FLOOR |
| COSTA MESA, 92626 UNITED STATES |
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05/02/2024 05:14 PM
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