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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18382650
Filing Dt:
10/23/2023
Publication #:
Pub Dt:
02/08/2024
Inventors:
Louis Douglas Smith JR., John Ralph Bumgardner, Jeffery Allen Boekeloo et al
Title:
Packaging Material with Indicium in Metallic Layer
Assignment: 1
Reel/Frame:
065662/0598Recorded: 11/27/2023Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2023
Exec Dt:
07/18/2023
Exec Dt:
07/31/2023
Exec Dt:
08/18/2022
Assignee:
1400 ABBOTT DRIVE
ELGIN, ILLINOIS 60123
Correspondent:
ADDITON, PENDLETON & WITHERSPOON, P.A.
P.O. BOX 567
MONROE, NC 28111

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