Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18264378
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Filing Dt:
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08/04/2023
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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Mr. Hui Wang, Jian Wang, Mr. Zhaowei Jia, Hongchao Yang, Jun Cai, Chenhua Lu, Jiaqi Li et al
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Title:
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ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 4, NO. 1690, CAI LUN ROAD |
| PILOT FREE TRADE ZONE, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| JEFFREY S BERGMAN |
| 1100 LOUISIANA STREET |
| ENTERPRISE PLAZA STE 4900 |
| HOUSTON, TX 77002 |
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