Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18266237
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Filing Dt:
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06/08/2023
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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George Maxim, Julio C. Costa, Dirk Robert Walter Leipold, Baker Scott
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Title:
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3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW THERMAL CONDUCTIVITY DIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7628 THORNDIKE ROAD |
| GREENSBORO, NORTH CAROLINA 27409 |
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| WITHROW + TERRANOVA |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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05/27/2024 01:48 PM
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