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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17970964
Filing Dt:
10/21/2022
Publication #:
Pub Dt:
02/08/2024
Inventors:
Ho-Ming TONG, Chao-Chun LU, Wei YEN
Title:
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
Assignment: 1
Reel/Frame:
064805/0567Recorded: 09/06/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/01/2023
Exec Dt:
09/01/2023
Exec Dt:
09/01/2023
Assignees:
2F., NO. 22, LN. 35, JIHU RD., NEIHU DIST.
TAIPEI CITY, TAIWAN 114754
NO. 6, TECHNOLOGY ROAD 5
HSINCHU, TAIWAN
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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