Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17879249
|
Filing Dt:
|
08/02/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/08/2024
| | | | |
|
Inventors:
|
Tien-Chung Yang, Li-Hsien Huang, Ting-Ting Kuo, Yao-Chun Chuang, Yinlung Lu
|
|
Title:
|
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| FAY SHARPE LLP |
| 1228 EUCLID AVE |
| FLOOR 5 |
| CLEVELAND, OH 44115 |
|
|
Search Results as of:
05/25/2024 10:19 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
