Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18017969
|
Filing Dt:
|
01/25/2023
|
|
Publication #:
|
|
Pub Dt:
|
02/08/2024
| | | | |
|
Inventor:
|
Koji SASAKI
|
|
Title:
|
CONDUCTIVE COMPOSITION, DIE ATTACHMENT MATERIAL, PRESSURE-SINTERED DIE ATTACHMENT MATERIAL, AND ELECTRONIC COMPONENT
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
|
|
|
|
| RANKIN, HILL & CLARK LLP |
| 38210 GLENN AVENUE |
| WILLOUGHBY, OH 44094 |
|
|
Search Results as of:
05/05/2024 12:31 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
