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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18360159
Filing Dt:
07/27/2023
Publication #:
Pub Dt:
02/15/2024
Inventor:
Ryohei YAMAMOTO
Title:
LASER PROCESSING MACHINE AND MANUFACTURING METHOD OF WAFER
Assignment: 1
Reel/Frame:
064403/0159Recorded: 07/27/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/12/2023
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU,
TOKYO, JAPAN 143-8580
Correspondent:
GREER BURNS & CRAIN LTD.
300 S. WACKER DRIVE, SUITE 2500
CHICAGO, IL 60606

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