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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18269616
Filing Dt:
06/26/2023
Publication #:
Pub Dt:
02/15/2024
Inventors:
Yohei Harada, Junya Oishi
Title:
POLYCRYSTALLINE SiC COMPACT AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
064059/0249Recorded: 06/26/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/13/2023
Assignee:
2-3 KITA-AOYAMA 1-CHOME
MINATO-KU, TOKYO, JAPAN 107-8636
Correspondent:
ALEXANDRIA P. STITELER
4 CENTURY DRIVE
SUITE 300
PARSIPPANY, NJ 07054

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