Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18229700
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Filing Dt:
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08/03/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Inventors:
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Yang Liu, Raffaele Luca Amalfi, Ryan Enright
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Title:
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Three-Dimensional Chip Comprising Heat Transfer Means
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 600-700 MOUNTAIN AVENUE |
| MURRAY HILL, NEW JERSEY 07974-0636 |
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| NOKIA OF AMERICA CORPORATION |
| 600-700 MOUNTAIN AVENUE |
| MURRAY HILL, NJ 07974-0636 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KARAKAARI 7 |
| ESPOO, FINLAND 02610 |
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| NOKIA OF AMERICA CORPORATION |
| 600-700 MOUNTAIN AVENUE |
| MURRAY HILL, NJ 07974-0636 |
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05/21/2024 07:55 PM
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