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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17975646
Filing Dt:
10/28/2022
Publication #:
Pub Dt:
02/15/2024
Inventors:
Tien-Hsi Lee, Jun-Huang Wu, Yu-Sheng Chiou, Shu-Cheng Li, Wei-Chi Huang, Yu-Tang Lin
Title:
SILICON CARBIDE SUBSTRATE OR SUBSTRATE PROCESSING METHOD
Assignment: 1
Reel/Frame:
061573/0475Recorded: 10/28/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/26/2022
Exec Dt:
09/26/2022
Exec Dt:
09/26/2022
Exec Dt:
09/26/2022
Exec Dt:
09/26/2022
Exec Dt:
10/07/2022
Assignee:
NO. 300, ZHONGDA RD., ZHONGLI DISTRICT
TAOYUAN CITY, TAIWAN 320317
Correspondent:
YUAN-TE FU
20800 VALLEY GREEN DR APT 433
CUPERTINO, CA 95014

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