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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
18493379
Filing Dt:
10/24/2023
Publication #:
Pub Dt:
02/15/2024
Inventors:
John Patrick Burke, Ibrahym bin Ahmad, Fakhrozi Bin Che Ani et al
Title:
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
Assignment: 1
Reel/Frame:
065326/0763Recorded: 10/24/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/04/2022
Exec Dt:
04/04/2022
Exec Dt:
04/03/2022
Exec Dt:
04/02/2022
Exec Dt:
04/02/2022
Exec Dt:
04/01/2022
Assignee:
5601 GREAT OAKS PARKWAY
SAN JOSE, CALIFORNIA 95119
Correspondent:
MICHAEL BEST & FRIEDRICH LLP
790 N. WATER STREET
SUITE 2500
MILWAUKEE, WI 53202
Assignment: 2
Reel/Frame:
065656/0649Recorded: 11/21/2023Pages: 35
Conveyance:
PATENT COLLATERAL AGREEMENT- A&R
Assignor:
Exec Dt:
11/17/2023
Assignee:
10 SOUTH DEARBORN
CHICAGO, ILLINOIS 60603
Correspondent:
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219
Assignment: 3
Reel/Frame:
065657/0158Recorded: 11/21/2023Pages: 35
Conveyance:
PATENT COLLATERAL AGREEMENT - DDTL
Assignor:
Exec Dt:
11/17/2023
Assignee:
10 SOUTH DEARBORN
CHICAGO, ILLINOIS 60603
Correspondent:
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219

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