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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18269486
Filing Dt:
06/23/2023
Publication #:
Pub Dt:
02/15/2024
Inventors:
Simon David HART, Daniel RENDELL, Paul Donald SPENDLEY, Rajesh KUDIKALA
Title:
SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED HEATSINK
Assignment: 1
Reel/Frame:
064338/0881Recorded: 07/21/2023Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/17/2023
Exec Dt:
07/18/2023
Exec Dt:
07/18/2023
Exec Dt:
07/18/2023
Assignee:
11-14 OXFORD INDUSTRIAL PARK
MEAD ROAD, YARNTON, KIDLINGTON
OXFORDSHIRE, UNITED KINGDOM OX5 1QU
Correspondent:
MEUNIER CARLIN & CURFMAN LLC
999 PEACHTREE STREET NE
SUITE 1300
ATLANTA, GA 30309

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