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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17992447
Filing Dt:
11/22/2022
Publication #:
Pub Dt:
02/29/2024
Inventors:
Lei Zhao, Hui Wang, Haizhou Wang, Yunhai Jia, Xing Yu, Lixia Yang, Xuejing Shen, Dongling Li et al
Title:
High-throughput 3D printing system for preparing multi-component, small sized samples
Assignment: 1
Reel/Frame:
061856/0385Recorded: 11/22/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Exec Dt:
11/21/2022
Assignee:
NO.13, GAOLIANGQIAOXIE STREET, HAIDIAN DISTRICT,
BEIJING, CHINA
Correspondent:
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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