Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18263552
|
Filing Dt:
|
07/31/2023
|
|
Publication #:
|
|
Pub Dt:
|
02/29/2024
| | | | |
|
Inventors:
|
Yosuke OI, Masahiro ASAHARA, Daisuke MORI
|
|
Title:
|
METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1-17 SHINMACHI, NISHI-KU |
| OSAKA, JAPAN 550-8668 |
|
|
|
|
| STINSON LLP |
| 7700 FORSYTH BLVD., SUITE 1100 |
| ST. LOUIS, MO 63105 |
|
|
Search Results as of:
05/03/2024 10:01 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
