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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17900446
Filing Dt:
08/31/2022
Publication #:
Pub Dt:
02/29/2024
Inventors:
Kwang-Soo KIM, Vivek ARORA, Woochan KIM
Title:
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
Assignment: 1
Reel/Frame:
061050/0681Recorded: 09/09/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/31/2022
Exec Dt:
09/02/2022
Exec Dt:
09/01/2022
Assignee:
12500 TI BOULEVARD
M/S 3999
DALLAS, TEXAS 75243
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
PO BOX 655474
M/S 3999
DALLAS, TX 75265

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