Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17894105
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Filing Dt:
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08/23/2022
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Publication #:
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Pub Dt:
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02/29/2024
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Inventors:
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Kandabara Tapily, Soo Doo Chae, Satohiko Hoshino, Hojin Kim, Adam Gildea
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Title:
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NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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05/06/2024 02:02 PM
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